Product Range
4-28 layer of high-precision impedance, blind & buried layers, HDI boards, high frequency board, halogen-free boards, high-TG boards, aluminum, copper, iron base and ceramic-based circuit board, 1-6 layer flexible circuit board ( FPC) and rigid-flex flexible board, and other high-tech products.
PCB Process Capability
processing layers:1-28 layers
Finished thickness (thinnest - the thickest): 0.008 "~ 0.24" (0.20mm ~ 6.0mm)
Minimum aperture: 6mil (0.15mm)
Minimum line width / spacing :3-4 mil (0.076-0.10mm)
Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm)
Impedance Control: ± 10%
Surface Treatment: OSP, HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger, immersion Silver, Immersion Tin.
Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), high frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE) ,, AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), ceramic substrate (Ceramic Base)
FPC Process Capability
processing layers:1-6 layers
Finished thickness (thinnest): 3mil (0.08mm)
Minimum aperture: 4mil (0.10mm)
Minimum line width / spacing: 2 mil (0.05mm)
Maximum board size: 10 "x 45" (250x 1200mm)
Surface Treatment: OSP, HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold
Insulation resistance: ± 1011Ω (Normal Normal)
Thermal shock resistance: 260 ℃ 10 sec.
Processing materials: polyimide (PI), polyester (PET), polyimide (PI) + FR4
